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Apache Design Solutions 招聘
2007-08-01 来自 复旦大学
标 题: Job Openings in Apache Design Solutions
发信站: 饮水思源 (2007年07月30日14:15:28 星期一), 站内信件
Job Openings in Apache Design Solutions (Shanghai)
安派电子科技(上海)有限公司
上海市浦东新区向城路58号(东方科技大厦)23楼A座
About Apache Design Solutions
Headquartered in Silicon Valley California, Apache delivers the leading
power sign-off solution adopted by 70% of the top semiconductor companies and a complete platform solution for silicon integrity of low-power, high-performance system-on-a-chip (SoC) designs. Apache's innovative platform considers all sources of noise that impacts the design - such as power, signal, package/system IO, substrate, and temperature. Apache's silicon integrity platform enables designers of leading networking, wireless, communication, consumer, and semiconductor companies to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon. Apache's vendor-neutral solution enables designers to adopt any industry-standard physical design flow and is certified by TSMC's 5.0, 6.0, and 7.0 Reference Flow (NYSE: TSM). Apache has 5 RD and engineering centers (Mountain View CA, Chengdu China, Shanghai China, HsinchuTaiwan and Bangalore India) and direct sales and support offices worldwide with over 40 customers, including 8 of the top 10 semiconductor companies. For more information, visit www.apache-da.com.
Location: Shanghai, China
Send Resume to: jizheng@apache-da.com
Job Description
Working closely with both RD and Application Engineering teams and
responsible for defining and supporting IC-package-PCB signal and power
integrity solutions including product specification, technical marketing
and carrying out customer evaluation and benchmark
Qualifications
Minimum 2 years (5 years for Sr.) SI hardware engineering experience
Proficiency with SPICE circuit simulation, field-solver and time/frequency
domain analysis
Solid background in transmission line theory
Familiarity with high-performance I/O technologies such as LVDS, CML, HSTL
Familiarity with package and PCB power delivery network modeling
Experience with HSPICE, HFSS, PowerSI/SIwave, Paksi-E/TPA
Experience in correlating simulation results with lab measurement is a plus
Self motivation, teamwork and strong communication skills
Position II R&D Engineer - Simulation and Modeling
Location: Shanghai, China
Send Resume to: jizheng@apache-da.com
Job Description
Responsible for maintaining and developing new features and algorithms for
the state of the art System-on-Chip (SoC) power and signal integrity
solutions.
Qualifications
Strong knowledge in C/C++ programming
Good software engineering skills
Ability to communicate effectively in conversation, presentations, and
written documents
Knowledge and/or experience in at least one of the following areas
- SPICE algorithm for circuit analysis and simulation, AC and transient
- Interconnect/transmission line modeling and Model Order Reduction
- Electromagnetic modeling of package and PCB, EMI/EMC
- IC, package and PCB physical design- placement and routing
Experience in EDA software development preferred
M.S. or Ph.D. in Electrical Engineering, Computer Science or other related
areas
Position III R&D Engineer - IC Thermal Simulation
Location: Shanghai, China
Send Resume to: jizheng@apache-da.com
Job Description
Responsible for maintaining and developing new features and algorithms for
the state of the art IC thermal-electrical solutions
Qualifications
Strong knowledge in C/C++ programming
Good software engineering skills
Ability to communicate effectively in conversation, presentations, and
written documents
Knowledge/experience in CFD or numerical thermal simulation is required
Experience with thermal analysis tools such as FLUENT and FLOTHERM is
required
Knowledge on IC design and related thermal issues is preferred
Experience in EDA software development is a plus
M.S. or Ph.D. in Electrical/Mechanical Engineering, Physics, Computer
Science or other related areas
Position IV R&D Engineer - Software QA
Location: Shanghai, China
Send Resume to: jizheng@apache-da.com
Job Description
Responsible for the validation, automation of software quality control and
release control for System-On-Chip power and signal integrity solutions
Qualifications
Strong knowledge in C/C++ programming
Strong Tcl or Perl script programming
Good software engineering skills
Ability to communicate effectively in conversation, presentations, and
written documents
Experience in software validation, QA
Experience in EDA software development is a plus
B.S or M.S. in Computer Science, Electrical Engineering, Physics or other
related areas
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