IBM中国集成电路部门2008校园招聘

2007-10-26 来自 日月光华

IBM中国集成电路部门2008校园招聘日程安排
(Through IBM CDL Recruiting Portal)

We, the IBM GES(Global Engineering Solutions) Chip Design (China) team, have finished the first round resume review and begin our first round interview. We will visit 5 cities this tow month. We post our draft interview schedule now as the reference to those who have applied.

2007.10.20-2007.10.21
Notify SH candidates
2007.10.22-2007.10.27
Shanghai 1st&2nd IV
2007.10.22-2007.10.23
Notify BJ candidates
2007.10.28-2007.11.01
Beijing 1st&2nd IV
2007.11.02-2007.11.12
None
("ASICON 2007 conference" will be
hold at Oct.25-Oct.30. We black these
days for the candidates who will
attend the conference
2007.11.13-2007.11.14
Hangzhou, 1st&2nd IV2007.11.15-2007.11.16
Nanjing, 1st&2nd IV
2007.11.17-2007.11.18
Xi'An, 1st&2nd IV
********
Comment:
1. "ASICON 2007 conference" will be hold at Oct.25-Oct.30.
We black these days for the candidates who will attend the conference.
2. For those qualified candidates who are not in the above five city, we will give them a telephone interview.
3. Those who have applied online, pls do not send your resume to us by email anymore. We have reviewed the all online-resume. For those who have not applied on-line,
you may send mail to wangyish@cn.ibm.com
The email title should be NAME_CITY_POSITION(in chinese)
Also you need to send me your Cn&En resume in ONE WORD FILE with your name(in CHINESE) as the file name in the email.
5. Our campus recruitment will last until mid-November. Most of the work will follow this schedule. This schedule is not totally fixed. We may changed a little.
Most of the intervews will according this schedule, but we may still give you a interview someday else than this schedule.

附：
IBM中国集成电路部门2008校园招聘信息
(Through IBM CDL Recruiting Portal)

Who we are

We, the IBM GES(Global Engineering Solutions) Chip Design (China) team are the IBM local IC design center in China of IBM GES, which provide IC design services to the clients all over the world and support IBM internal chip and semiconductor development missions.

-- We, the IBM GES Chip Design(China) team, has come to China for more than 3 years.
-- We have invited most of the top designers from the graduates to join IBM in these 3 years -- that makes us so successful
a design center.
-- We will keep doing this and we are waiting for you right here to be part of our SAGA.

What we do
We provided IC design services to the clients all over the world and support IBM internal chip and semiconductor development
missions:
-- We help our clients to design PowerPC based SoC design.
-- We provided backend design services (Timing, PD, package, etc -- ASIC design services in IBM's glossary :) )
-- We provided frontend design services(logic design, verification, FPGA demo, etc.)
-- We also do analog design, circuit design, foundry AE, etc.

In one word:

We are not just doing "peice of these" but really we are doing "ALL of these". We provide so called "end to end" SoC, ASIC and other semiconductor solutions to our customers in China and worldwide.

What position we have
As you can see in the previous section, we are doing "ALL of these". We are very interested if your are well qualified on

-- Backend design(Timing, Synthesis, Physical Design, DFT, circuit design, etc.)
-- Frontend design(Logic design, Verfication, FPGA implementation, etc.)
-- Analog, RF, Mixed signal(Good News :)! This position are new open this year.)
-- Semiconductor device design, Foundry AE(Good News :)!
This position are new open this year.)

Actually, if you are qualified on each peice of IC design, come on, We need you!

How many we want

There is no "hard limit" to Chip Design Engineer so far. We are growing very fast, we may growing most faster this year. During the past 3 year, the number of IBM GES China Component grows from 8 to 15 to current more then 30. You may "guess" how many we want :).

How to apply

Position:

IBM Global Engineering Solution (GES) Chip Design Engineer (SH)
http://campus.chinahr.com/2008/pages/bluestart/jobsdetail.asp?jid=12614000033

IBM Global Engineering Solution (GES) Chip Design Engineer (BJ)
http://campus.chinahr.com/2008/pages/bluestart/jobsdetail.asp?jid=12614000032

This database will be open till Oct. 20, 2007, but you can
still send us you resume after that. We recommended that you
apply on Chinahr. You can also send your resume by email to

wangyish@cn.ibm.com

if the database is closed or you face any problem while applying.

==================Q&A Highlight================

1. 笔试会考软件的问题么？
   IBM GES 将直接通过筛选简历发出面试通知，笔试成绩不会阻止您进入面试。当然，好的笔试成绩会令我们对您的评价更高。

2. 你们也需要模拟的么？
   analog, rf, circuit design 的职位, 模拟，RF，mixed, semiconductor device, Foundry AE 方面的人才都在我们今年的关
注之列。具体请查看Q&A all Num1.

3. 你们和原来CRL的LSI组有什么关系？往年IBM CRL会招LSI方向的，今年不招了么？
    我们就是原来的CRL LSI。CRL不招LSI方向了，因为我们改为从CDL的流程招聘集成电路设计方面的人才。
    在部门成立之处，我们挂靠在CRL下。随着部门的发展壮大，组织结构也发生了一些改变。我们现在是CDL的一部分，我们的招聘也是随着CDL的程序一同进行的。但是由于我们所需求的人才和CDL的主要招聘对象有一些不同，招聘标准和流程和会有一些不同。

4. 你们的招聘流程如何？
    如前所述，我们的招聘随着CDL的程序一同进行，但是有一些不同：
        -> 我们不关心笔试成绩，将根据简历筛选的结果直接发出面试通知。
        -> 我们将于10月23日第一轮简历筛选完毕后，陆续发出面试通知。

==================Q&A all================

1、网站上列出的工作内容从结构设计实现、模拟验证FPGA验证、逻辑综合物理综合到DFT，几乎涵盖了ASIC设计实现的所有流程，请问中国该部门的具体工作是那些？从事结构设计和验证的工作具体是那些，可否举一两个例子说明？

>> China Design Center的具体工作就是上述所有这些 :). We are not just doing "peice of these" but really we are doing "ALL of these". We provide so called "end to end" SoC, ASIC and other semiconductor solutions to our customers in China and worldwide. Let me give you some "real" examples
that we have done/be doing in the last couple years to help you understand how we work them out:

A) We used to design and implement an innovative SMID DSP co-processor for PowerPC architecture all from scratch... from the architecture all the way to physical design and also full functional FPGA prototype with realtime video decoding playback through the DSP and the SoC superstrucuture surrounding by.

B) We used to get those among the largest ASIC chips in the world done in China design center, with the biggest die size ranging from 14mm x 14mm to 18mm x 18mm and beyond... China design center did everything for our customers from netlist to tapeout with silicon-package co-design. Who were those
"customers"? Well you know the companies who provide the best communication equipments in China and world, but can you guess who did those "heart chips" for them :).

Getting excited? Then look into these that are also happening in China...

C) We have the world's first PowerPC + ARM(AMBA) hybrid SoC design/verification environment established in China design center by our engineers, we are not just following "existing" methodology, when there is no one in the world, we create them.
D) We have been working on couple world's most complicated SoCs from logic design/integration/verification to synthesize/timing and physical design... which involves whole bunch of models and tools to get through the software-hardware co-design/verification.

2、请问这个部门在中国的规模有多大？技术先进性如何？
>> We are about 60 people so far. more than 30 chip designers as the China chip design center and another 20+ system/software designers working on other interesting system or software projects and sometimes also together with the chip designer on the SoC. We keep growing.

In terms of the technology... the most advanced technology we are using here(in China) is 45nm SOI for very high performance custom SoC/Processor design. For most of the ASIC and digital designs it's 90nm to 65nm as well as some 130nm. We are simply ahead of ALL other design centers in China.

3、IBM对于Design Service在中国的成长预期如何？员工在这个职位上的成长道路如何？

>> Service is simply one of IBM's biggest strategies. And now we are doing the most innovative service as that's part of the R&D activities to help build our customer's CORE competency -- we call it "Collaborative Innovation". IBM has been opening many many of our technologies in the last couple decades to
help our customer success -- and we succeeded thereby, now it finally reaches the essential part that built on our state-of-the-art semiconductor technology, this is simply a trends. Of course, nothing will be easy at the beginning -- there are so many challenges in the first couple years because it needs to change people's mind... we are changing the way people live by changing the way we work... but this is also essentially what makes it so interesting working in
this area. However, with so many challenges, we have still witnessed so strong growth and we have doubled our size 2 times in the last 3 consecutive years to match this growth ... and we will keep this high speed growth. We are so confident in China also because this "innovative" strategy perfectly aligned
with China's national strategy: Being an innovative society/country. There is another big strategy of IBM, that is, being a Global Integrated Enterprise... it will be so integrated that the China design center will not only serve China customers but as part of the integrated talent pool to serve IBM itself and customers in the rest of the world -- this is exactly what we are doing now and this is part of the globalization trends that you will experience yourself.

Having said these, now you can tell me what will be one's career -- when he/she will have a chance to not only witness this "happening history" but do make himself/herself part of it. We provide you a platform, you will compose your own career.

4、对硬件相关的职位，笔试包括软件的问题么
For hardware position, will the paper test including software question?

>> For "GES Chip Design Engineer" we will not very much care about your paper test. For example if you got 0 on Java questions I don't care it at all. We will see all the resumes ONE by ONE no matter your paper test is 0 or full score. Trust me that as I'm a chip designer myself I know very well what
means a good chip designer. But if you can also get high score in these software questions, it may somewhat add to your benchmark -- as I told you the GES business is very dynamic and covers a broad technology spectrum and many cross domain subjects, different kinds of knowledges and background will be very helpful to our business and your own career. Take it easy.

5、有多少芯片设计工程师的职位名额?？有上限么？
>> There is no "hard limit" to Chip Design Engineer so far, we will align our numbers with the business growth. It actually more depends on how many good talents we have seen -- so thank you very much for your help to post the information to BBS... this helps a lot. As I told you we have been growing very fast in the last 2-3 years and we will keep doing it this year. If you are interested in "guessing" a number, I think it's very reasonable to extrapolate our growth curve from the last 2 years - you can do the math by yourself :).

6、北京和上海的合作模式是什么？在项目和客户方面有什么区别？
What is the co-operation mode between BJ and SH position, is there any difference on projects or customers?

>> If you are asking about the "GES Chip Design Engineer"... the China design center team are mainly located in Shanghai. We might have some flexibility in the working location for the individuals but at the very beginning you will start your work in Shanghai as this helps most for your skill and career starter.

If you are asking about how GES positions related to other CDL/CSTL positions in Beijing and Shanghai... in general we have the different projects and missions and serves different IBM business areas/units and customers. For the "Chip Design Engineer", you know very well how it is different with other CDL/CSTL positions. However, we share some common part of the infrastructure and operation as well as the technical community, like what we are doing now in the campus recruiting. Also, when some specific opportunities come, we will be able to collaborate and integrate as one team to contribute to or leverage other IBM teams, not even limited to CDL/CSTL teams, but also CRL (China Research Lab), ITS, BCS etc... to build seamless solutions to help our clients' success.

==============More questions?==============

1. IBM 2008 campus recruiting bbs
http://campusbbs.chinahr.com/showforum-26.aspx
2. Send mail to wangyish@cn.ibm.com
3. ask your schoolmates in IBM GES