飞索半导体2008校园招聘

2007-09-21 来自 西北工业大学

飞索半导体是全球最大的专门提供闪存解决方案的高科技企业，为客户提供了最丰富、最全面的闪存产品线。飞索通过致力于为汽车、消费电子、网络和无线市场创建、保存和保护数字内容，从而，支持全球社会更加移动化、数字化和丰富多彩。公司在NASDAQ公开上市（代码[SPSN]）。我们拥有世界领先的”MirrorBit” 技术。总部位于美国桑尼维尔，全球现有员工约9400人。我们在苏州设有最先进的封装和测试基地,并在苏州和北京设有设计中心，在北京、上海和深圳设有销售和营销机构。

飞索（中国）有限公司作为飞索半导体的独资子公司，位于苏州工业园区一期启动区内，是飞索的制造和研发中心，批准投资额为2.16亿美元，现有员工1300人。我们拥有世界上最先进的IC封装和测试设备，以及开发实验环境。其具有业界领先科技的MCP（多层芯片）技术已经实现6层芯片的封装，并且具备更轻薄、更微小的工艺和开发条件。

在科技领先的同时，飞索提供有竞争力的薪酬，并且积极为员工营造“快乐”的企业文化，倡导“工作着，快乐着”的大家庭氛围。依靠敬业的员工团队，飞索在翰威特亚洲最佳雇主的评选中，荣膺2007中国最佳雇主和亚洲最佳雇主榜首。

欢迎各位勇于面对挑战的菁英加盟，带上你的事业梦想和飞索一起腾飞！

飞索半导体公司在苏州成立设计中心简介

飞索是全球最大的专注于Nor型闪存解决方案的半导体公司。随着全球半导体产业持续向亚太地区转移，中国已成为世界上经济发展最快的国家，并且在可见的未来将继续保持这种增长。为了满足当前和未来中国及亚洲客户的需求，飞索战略性地在中国苏州设立了全球第六个研发中心。

该研发中心初期投资约520万美元，并计划未来三年内的总投资达2300万美元。到2010年设计研发人员将达50人。中心将充分利用飞索先进的深度微米半导体制工艺技术，围绕具有独立知识产权的MirrorBit或QuadBit NOR型大容量闪型存储器，重点开发和设计片上系统芯片，使闪存，微控制器，应用接口控制电路等模块无缝集成在单一硅晶片上，同时配合相应应用软件，给客户提供一套完整的芯片应用系统解决方案。

该中心的成立，旨在通过以客户需求为本，向客户提供成本效益最佳的系统解决方案，提高飞索产品在中国和亚太地区不断增长的市场中的竞争力。

飞索半导体校园招聘职位：

IC Design Center Positions:

1. IC Design Engineer

Requirements:

MS or PhD degree in Microelectronics/Computer Engineering/Digital Communication or related engineering field
Solid understanding of computer architecture, MCU (8051, ARM), digital logic, analog design basics and fundamentals of IC design flow
Excel in digital logic design, verilog/VHDL, and MCU related courses
Basic knowledge of flash or novitiate memory is desirable, but not manatory
Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages
Knowledge of Vera, SystemC or SystemVerilog is a big plus
School project experience in IC design/verification or validation in FPGA is a plus
Self-motivated, detail-oriented, a quick learner and a good team player
Verilog or VHDL RTL coding and synthesis

Exceptional Oral and Written communication skills
Fluent in both oral and written English

Responsibility:

Architectural and RTL design of complex, multi-million gate ASICs
Simulation and verification functional modules, synthesis, static timing analysis, and physical floorplanning
Additional responsibilities may include design validation on FPGA platform, and interface with engineers in analog, backend, firmware/software, system engineering teams and marketing teams…

2 . IC Backend Engineer

Requirements:

Minimum BS degree in Microelectronics/Computer Engineering/Digital Communication or related engineering field
Understanding of computer architecture, MCU (8051, ARM), digital logic or analog design basics a plus
Understanding of fundamentals of IC design flow
Excel in digital logic design, verilog/VHDL, and MCU related courses
Basic knowledge of flash or novitiate memory is desirable, but not manatory
Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages a plus
Self-motivated, detail-oriented, a quick learner and a good team player
Strong written and verbal communication skills.

Exceptional Oral and Written communication skills
Fluent in both oral and written English a plus

Responsibility:

F loorplanning, gate placement, clock tree design and implementation
Power grid design and implementation, routing, physical verification (LVS/DRC)
On-chip signal integrity analysis (EM, IR drop, xtalk, antennas, etc.), and GDSII generation
Additional responsibilities include working closely with logic designers to enable physical synthesis based on the floor-planning

3 . Application Engineer

Requirements:

Minimum Bachelor degree in Microelectronics, Computer Science/Engineering, Control Science/Engineering or related engineering fields.
Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages
Understanding of software engineering methodology
Knowledge of computer architecture (e.g. 8051, ARM), embedded systems and FPGA a big plus
Basic knowledge of flash or novitiate memory is desirable, but not mandatory
Embedded hardware design/development or debugging experience a big plus
Exceptional Oral and Written communication skills
Fluent in both oral and written English

Responsibility:

· S ystem application, middle ware and driver development on Linux/WinCE

· Product specification, system verification/validation and support of key customers

· Additional responsibilities may include failure analysis, and interface with IC design engineers

4 . Firmware/Software Engineer

Requirements:

Minimum Bachelor degree in Microelectronics, Computer Science/Engineering, Control Science/Engineering or related engineering fields.
Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages
Understanding of software engineering methodology
Knowledge of computer architecture (e.g. 8051, ARM), embedded systems and FPGA a big plus
Basic knowledge of flash or novitiate memory is desirable, but not mandatory
Embedded hardware design/development or debugging experience a big plus
Exceptional Oral and Written communication skills
Fluent in both oral and written English

Responsibility:

· S ystem/software architecture design, product specification, hardware & software co-design

· System & software development, verification, FPGA validation and system level test and release to production, and working very closely with IC design teams in New Production Introduction

· Additional responsibilities may include customer support, failure analysis, and interface with IC design engineers, and marketing teams

西北工业大学校园招聘会：

校园招聘会宣讲时间：

2007 年 10 月 29 日下午 14:00-16:00

宣讲地点：

航空楼D座环形报告厅

Note ：

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